How Measuring Out-of-Plane Strain in van der Waals Materials Will Shape Future Quantum Devices

Imagine a world where your smartphone is as thin as paper, yet processes quantum calculations without overheating. This future relies on atomic-scale engineering, where even a tiny bend can disrupt how electricity flows.

To build these devices, engineers must control out-of-plane strain in van der Waals materials, which are ultra-thin layers of atoms held together by weak forces. Until now, measuring these microscopic vertical squeezes without destroying the material was nearly impossible.

Detecting Out-of-Plane Strain in van der Waals Materials

Researchers recently developed a non-invasive optical method using mid-infrared light. They utilised "hyperbolic polaritons"—hybrid particles of light and matter—to probe hexagonal boron nitride. This technique successfully measured atomic displacements as small as 10 picometres, which is about 800,000 times smaller than the wavelength of the light used.

This measurement capability allows scientists to map hidden mechanical stress inside quantum structures. By the time you graduate from university, this technique may help scale up quantum computing hardware and flexible sensors.

To build this future, tomorrow's engineers will need skills in:

• Quantum physics to understand atomic interactions.
• Computer science to simulate nanoscale optical properties.
• Materials science to synthesise new atomic heterostructures.

Learning to code or studying physics today prepares you to design these atomic-scale technologies.